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| Artikel-Nr.: 858A-9783642059155 Herst.-Nr.: 9783642059155 EAN/GTIN: 9783642059155 |
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| During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Weitere Informationen: | | Author: | Marin Alexe; Ulrich Gösele | Verlag: | Springer Berlin | Sprache: | eng |
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| Weitere Suchbegriffe: Silicon-on-Insulator; basics; crystal; integrated circuit; logic; optoelectronics; Semiconductors; compound semiconductors; Diode; Helium-Atom-Streuung; MEMS; Semiconductor, Compound semiconductors, Diode, Helium-Atom-Streuung, MEMS, Semiconductor, Silicon-on-insulator, Wafer, Wafer bonding, basics, crystal |
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