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Springer Verlag 9783030298968 |
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Springer Verlag 9783662520789 |
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Springer Verlag 9783030177621 |
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2nd EAI International Conference on Smart Technology (1 Angebot) This book presents the proceedings of 2nd EAI International Conference on Smart Technology (MTYMEX), which took place April 27 , 2021, online and in Monterrey, Mexico. MTYMEX is an international co... |
Springer Verlag 9783031076695 |
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Springer Verlag 9783031527593 |
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Springer Verlag 9783319169002 |
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3D Stacked Chips (1 Angebot) This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integra... |
Springer Verlag 9783319204802 |
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3D Microelectronic Packaging (1 Angebot) This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic ... |
Springer Verlag 9783319445847 |
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3D Robotic Mapping (1 Angebot) The Simultaneous Localization and Mapping Problem with Six Degrees of Freedom |
Springer Verlag 9783642100581 |
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Springer Verlag 9783030787523 |
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Springer Verlag 9783540782865 |
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Springer Verlag 9783030787493 |
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Springer Verlag 9783030443719 |
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Springer Verlag 9783030460310 |
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Springer Verlag 9783031344886 |
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